WebDATE 2014 offers several workshops covering a large number of hot topics. Dependable GPU Computing, Engineering Simulation for Cyber-Physical Systems, Design Automation for Understanding Hardware Design, Manufacturable and Dependable Multicore Architectures at Nanoscale, 3D Integration: Applications, Technology, Architecture, … WebDate Added to IEEE Xplore: 13 June 2024 ISBN Information: Electronic ISBN: ... 2024 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Article #: Date of ... 2024 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Date of Conference: 21-25 May 2024 . Date Added to IEEE …
Workshops DATE 2024
WebThe University of Tokyo. Summary of the workshop: LTB3D-2024. This workshop will focus on low-temperature bonding technologies which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonic systems, … WebApr 19, 2024 · The 3D Integration Workshop took place in DATE conference from 2009 to 2015 and took place again in 2024. With the continued evolution of 3D technologies in terms of interconnect density and its evolving manufacturing eco-system, there is a strong need to pursue the research efforts on key aspects of architecture and design, according to the ... greenmailer peräkärry kokemuksia
Friday Workshops - Call for Papers and Posters DATE 2016
WebAt DATE 2009, one of the Friday Workshops is devoted to 3D Integration . This one-day event consists of a plenary keynote, regular and poster presentations, and a panel session. 3D Integration is a promising technology for extending Moore’s momentum in the next decennium, offering higher WebMar 23, 2024 · [email protected]. Start. Title. Fri, 18 Mar 2024. W01 European Automotive Reliability, Test and Safety (eARTS) Fri, 18 Mar 2024. W02 3D … WebThe workshop took place in conjunction with . DATE 2009, DATE 2010 and DATE 2011. You are invited to participate and subDATE 2012 Friday Workshop on mit your contributions to the 3D Integration. The areas of interest include (but are not limited to) the following topics: • 3D technologies: chip-on-chip, micro-bumping, green luxury villas mykonos